1 hmic tm silicon pin diode sp4t switch 50 mhz - 20 ghz rev. v4 masw-004103-1365 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. features ? specified from 50 mhz to 20 ghz ? usable up to 26 ghz ? low insertion loss ? high isolation ? low parasitic capacitance and inductance ? rohs compliant surmount? package ? rugged, fully monolithic ? glass encapsulated construction ? up to +38 dbm c.w. power handling 1 @ +25c ? silicon nitride passivation ? polymer scratch protection description the masw-004103-1365 is a surmount? broadband monolithic sp4t switch using series and shunt connected silicon pin diodes. this part is designed for use as a moderate signal, high performance switch in applications up to 20 ghz. this surface mount chipscale configuration is optimized for broadband performance with minimal associated parasitics usually associated with hybrid mic designs incorporating beam lead and pin diodes that require chip and wire assembly. the masw-004103-1365 is fabricated using m/a- com technology solutions patented hmic? (heterolithic microwave int egrated circuit) process, us patent 5,268,310. this process allows the incorporation of silicon p edestals that form series and shunt diodes or vias by imbedding them in low loss, low dispersion glass. by using small spacing between elements, this comb ination of silicon and glass gives hmic devices low loss and high isolation performance through low millimeter frequencies. selective backside metalization is applied producing a surface mount device. the topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. these protective coatings prevent damage to the junction and the anode airbridge during handling and assembly. pin configuration 2 2. the exposed pad centered on the chip bottom must be connected to rf and dc ground. ordering information 2 pin function j1 rfc j2 rf1 j3 rf2 j5 rf4 j4 rf3 j1 j2 j5 j3 j4 functional schematic 1. power handling testing performed @ 2ghz ordering information part number package masw-004103-13650g 50 piece gel pack masw-004103-13655p 500 piece reel masw-004103-13650p 3000 piece reel masw-004103-001smb sample test board
2 hmic tm silicon pin diode sp4t switch 50 mhz - 20 ghz rev. v4 masw-004103-1365 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. parameter conditions units min. typ. max. insertion loss 6 ghz 13 ghz 20 ghz db ? ? ? 0.5 0.8 1.2 0.6 1.0 1.5 isolation 6 ghz 13 ghz 20 ghz db 48 38 29 51 39 32 ? ? ? input return loss 6 ghz 13 ghz 20 ghz db 17 13 12 21 17 16 ? ? ? output to output isolation 6 ghz 13 ghz 20 ghz db ? ? ? 53.5 41.5 31.5 ? ? ? input 0.1db compression point 2 ghz db ? 36 ? iip3 0.5 ghz, 5 mhz spacing, +20dbm 1 ghz, 10 mhz spacing, +20dbm 2 ghz, 10 mhz spacing, +20dbm dbm ? ? ? 60 63 64 ? ? ? switching speed 3 ns ? 20 ? voltage rating 4 v ? ? 80 electrical specifications: t a = 25c, p in = 0 dbm, z 0 = 50 ? , 20ma/-10v 3. typical switching speed measured from 10% to 90 % of detected rf signal driven by ttl compatible drivers. 4. maximum reverse leakage current in either the shunt or series pin diodes shall be 0.5 ua maximum @ -80 volts. parameter absolute maximum operating temperature -65 c to +125 c storage temperature -65 c to +150 c junction temperature +175 c applied reverse voltage |-80 v| rf cw incident power 38dbm cw @ 2ghz, +25c 33dbm cw @ 20ghz, +25c bias current +25c 50 ma absolute maximum ratings 5,6 5. exceeding any one or combination of these limits may cause permanent damage to this device. 6. m/a-com tech does not recommend sustained operation near these survivability limits. max operating conditions for combination rf pwr, dc bias, & temp: 33dbm cw @ 20ma per diode @ +85oc @ 2ghz handling procedures please observe the following precautions to avoid damage: static sensitivity these devices are rated at class 1a human body. proper esd control techniques should be used when handling these devices.
3 hmic tm silicon pin diode sp4t switch 50 mhz - 20 ghz rev. v4 masw-004103-1365 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. masw-004103-1365 maximum input power curve baseplate temperature fixed @ 25degc 0 2 4 6 8 10 12 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 insertion loss (db) input power (watts ) 2ghz, 6.4w 10ghz, 3.1w 20ghz, 2w typical performance curves -100 -80 -60 -40 -20 0 0 5 10 15 20 25 30 isolation @ 20ma -10v rf input to rf outputs (j1 to j2, j3, j4, j5) j1 to j2 j1 to j3 j1 to j4 j1 to j5 isolation (db) frequency (ghz) -40 -30 -20 -10 0 0 5 10 15 20 25 30 input return loss @ 20ma -10v rf input to rf outputs (j1 to j2, j3, j4, j5) j1 to j2 j1 to j3 j1 to j4 j1 to j5 input return loss (db) frequency (ghz) -40 -30 -20 -10 0 0 5 10 15 20 25 30 o utput return loss @ 20m a -10v rf input to rf outputs (j1 to j2, j3, j4, j5) j1 to j2 j1 to j3 j1 to j4 j1 to j5 output return loss (db) frequency (ghz) -2.0 -1.5 -1.0 -0.5 0.0 0 5 10 15 20 25 30 insertion loss @ 20m a -10v rf input to rf outputs (j1 to j2, j3, j4, j5) j1 to j2 j1 to j3 j1 to j4 j1 to j5 insertion loss (db) frequency (ghz) -80 -60 -40 -20 0 0 5 10 15 20 25 30 output to output isolation @ 20ma, -10v j2 to j3 and j4 to j5 j2 to j3 j4 to j5 output to output isolation (db) frequency (ghz)
4 hmic tm silicon pin diode sp4t switch 50 mhz - 20 ghz rev. v4 masw-004103-1365 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. condition of rf output condition of rf output condition of rf output condition of rf output b2 b3 b4 b5 j1-j2 j1-j3 j1-j4 j1-j5 -15v at -20ma 7 6v at +20ma 6v at +20ma 6v at +20ma low loss isolation is olation isolation 6v at +20ma -15v at -20ma 7 6v at +20ma 6v at +20ma isolation low loss is olation isolation control level (dc currents and voltages) 6v at +20ma 6v at +20ma -15v at -20ma 7 6v at +20ma isolation isolation low loss isolation 6v at +20ma 6v at +20ma 6v at +20ma -15v at -20ma 7 isolation isolati on isolation low loss 7. the voltage applied to the off arm can vary as long as 20ma is applied through the shunt diode on the off arm. bias control optimal operation of the masw-004103-1365 is achieved by simultaneous applicat ion of negative dc voltage and current to the low loss switching arm and positive dc voltage and current to the remaining switching arms as shown in the applications circuit below. dc return is achieved via r2 on the rfc path. in the low loss state, the series di ode must be forward biased with current and the shunt diode reverse biased with voltage. in the isolated arm, the shunt diode is forw ard biased with current and the series diode is reverse biased with voltage. driver connections application circuit 8,9,10,11,12 notes: 8. assume vf ~ 1v at 20ma 9. r1 = 5v / 0.02a = 250 ? ; r2 = 9v / 0.02a = 450 ? 10. p r1 = 0.02a x 0.02a x 250 = 0.1 w 11. p r2 = 0.02a x 0.02a x 450 = 0.18 w 12. inductors are bias rf c hokes. the operating band width of a broad-band pin diode switch is often dependent on the bias comp o- nents, particularly the rf bias chokes. it is suggested that the frequency response be checked with all the bias components att ached before installing the pin diode. example: j1 to j2 low loss r1 = 250 ? r2 = 450 ? b2 = -15v b3, b4, b5 = 6v
5 hmic tm silicon pin diode sp4t switch 50 mhz - 20 ghz rev. v4 masw-004103-1365 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. outline drawing footprint units in m backside view shows the back metal that is the foot pr int of the chip and all dimension are +/-0.5um ground radius is 200um centered on the i/o pad. masw-004103-1365 dim inches mm min max min max width 0.06220 0.06417 1.580 1.630 length 0.08740 0.08937 2.220 2.270 thickness 0.00394 0.00591 0.100 0.150
6 hmic tm silicon pin diode sp4t switch 50 mhz - 20 ghz rev. v4 masw-004103-1365 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. handling procedures attachment to a circuit board is made simple through the use of standard surface mount technology. mounting pads are conveniently located on the bo ttom surface of these devices and are removed from the active junction locations. these devices are well suited for solder a ttachment onto hard and soft substrates. the use of 80au/20sn, or rohs compliant solders is recommende d. for applications w here the average power is 1w, conductive silver epoxy may also be used. cure per manufacturers recommended time and temperature. typi- cally 1 hour at 150c. when soldering these devices to a hard substrate, a so lder re-flow method is prefer red. a vacuum tip pick-up tool and a force of 60 to100 grams applied to the top surface of the device while placing the chip is recom- mended. when soldering to soft substrates, such as duroid, it is recommended to use a soft solder at the circuit board to mounting pad interface to minimize stress due to any tce mismatches that may exist. position the die so that its mounting pads are aligned with the circuit board mounting pads. solder reflow should not be per- formed by causing heat to flow through the top surface of the die to the back. since the hmic glass is transpar- ent, the edges of the mounting pads can be visually inspected through the die after attachment is completed. typical re-flow profiles for sn60/pb40 and rohs compliant solders is provided in application note m538 , ?surface mounting instructions? and can viewed on the ma-com technology solutions website @ www.macomtech.com
7 hmic tm silicon pin diode sp4t switch 50 mhz - 20 ghz rev. v4 masw-004103-1365 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. .157 .004 4.00 0.10 2.00 0.05 .079 .002 .157 .004 4.00 0.10 .059 .004 thru 1.5 .069 .004 1.75 0.10 +.012 +0.30 8.00 - 0.10 .093 .002 2.36 0.05 .012 .001 0.30 0.03 3.5 0.05 0.035 thru typ. 0.89 5 max. .012 .002 0.30 0.05 pocket depth .066 .002 1.80 0.05 .138 carrier tape dimensions pocket tape information chip orientation in tape
8 hmic tm silicon pin diode sp4t switch 50 mhz - 20 ghz rev. v4 masw-004103-1365 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. dim inches mm min. max. min. max. a 6.980 7.019 177.3 178.3 b .059 .098 1.5 2.5 c .504 .520 12.8 13.2 d .795 .815 20.2 20.7 w 1 .331 .337 8.4 8.55 w 2 ?- .567 ?- 14.4 n 2.146 2.185 54.5 55.5 reel information a
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